Investments pile up in Gujarat as PM Modi leads Vibrant Gujarat summit

India has urged global container terminal operator D P World to set up green and energy efficient ports in India and provide world class logistic infrastructure. Prime minister Narendra Modi met Ahmed bin Sulayem, the Group Chairman & CEO of DP World and discussed DP World’s plans to further bolster investment in India, especially pertaining to creating sustainable, green, and energy- efficient ports, and world class sustainable logistic infrastructure,” the PMO said. Prime Minister met some of the top global CEOs on the sidelines of the Vibrant Gujarat Summit as he lured investments across sectors to boost the state’s economy and create jobs.

DP World had last year signed a concession agreement with Gujarat’s Kandla Port Authority to Develop, Operate and Maintain a new 2.19 million TEU per annum Mega-container terminal.

Modi also met Keith Svendsen, CEO of A.P. Moller. “The PM welcomed their expansion plans in the GIFT City. Their discussions encompassed the crucial topics of green hydrogen and the development of logistics infrastructure,” the PMO said.

Modi and Toshihiro Suzuki, Representative Director & President, Suzuki Motor Corp, “discussed Maruti Suzuki’s plans to make India a strong player in the global automotive market by exporting Made in India vehicles, along with deploying global best practices related to vehicle scrapping and vehicle recycling into India,” the Prime Minister’s Office said in a post on X. Maruti Suzuki is looking to set up a second car manufacturing plant in Gujarat. This will be the firm’s fifth plant in the country.

“Mr. Sanjay Mehrotra, the President and CEO of Micron Technology, held a meeting with PM @narendramodi in Gandhinagar. They discussed Micron’s efforts to enhance the semiconductor manufacturing ecosystem in India,” the PMO said in a separate post on X. US chip making giant Micron has started construction of a USD 2.75 billion semiconductor factory in Sanand, about 40-km from Ahmedabad. The plant, which will focus on transforming wafters into ball-grid arrays (BGA) integrated circuit packages, memory modules and solid-state drives, is expected to be ready by December this year.